Wafer
Level Chip Scale Package is fast becoming popular because of its small form
factor utilized in such applications as Wifi, Bluetooth and GPS units. The
WLCSP is also very cost-effective with a simplified manufacturing process that
eliminates the need for the final or package test step.
SV
TCL & Associates Probe Company China Japan Europe's SpringTouchTM is an
ideal & economical solution for WLCSP test with spring pin probes that have
the capability to overcome the bump height variation across the wafer. SV TCL
also offers an RF option of this technology for WLCSPs that must be tested at a
higher frequency.
Other benefits include:
- Crown-shaped Probes
- Pitch Capability as Low as
300µm
- Customized Pins
- Easy Pin Replacement
- Socket Adapter for Single
Chip Testing
Contact your SV TCL
Representative so we can help you find the right SpringTouch product for your
vertical testing needs.
No comments:
Post a Comment