Tuesday, October 14, 2014

SV TCL & Associates Probe Company China Japan Europe LogicTouch

The shrinking of IC die geometries and the growing complexity of device designs are making the task of on-wafer testing increasingly more difficult. SV TCL's LogicTouch is suited perfectly for these types of advanced designs, a fine pitch technology utilizing a MEMS-style probe targeted for pad-limited devices such as High-Volume SoCs, Microcontrollers, DSPs and 3D Packages. LogicTouch is also ideal for the latest device applications including TSV (Through-Silicon Via) and Copper Pillar (Cu-Pillar).

- Fine Pitch Capability Down to 50┬Ám
- No Chip Design Limitations
- Probe Arrays
- Corner Pads
- Single Pin Repairable
- MEMS-Style Probes
- Greater Scrub Consistency
- More Dimensional Control


Contact your SV TCL Representative so we can help you find the right LogicTouch product for your vertical testing needs.

1 comment:

  1. I like your style of writing. You break it down nicely. Very informative post. Keep up the good work.
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